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| Data Sheet, V2.0, April 2009 BGF106C S I M C a r d I n t e r f a c e F i l te r a n d E S D P r o t e c t i o n Small Signal Discretes Edition 2009-04-14 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF106C SIM Card Interface Filter and ESD Protection BGF106C Revision History: 2009-04-14, V2.0 Previous Version: 2009-03-31, V1.0 Page all 5 Subjects (major changes since last revision) target status removed Table 1: maximum voltage on all pins increased to 5.5 V Data Sheet 3 V2.0, 2009-04-14 BGF106C SIM Card Interface Filter and ESD Protection BGF106C BGF106C Features * ESD protection circuit and interface filter for SIM cards * ESD protection according to IEC61000-4-2 for 15 kV contact discharge on external IOs * Wafer level package with SnAgCu solder balls * 400 m solder ball pitch * RoHS and WEEE compliant package WLP-8-11-N-3D Description BGF106C is an ESD protection circuit and filtering interface for SIM cards. All external IOs are protected against ESD pulses of 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free and halogen-free package with a size of only 1.2 mm x 1.2 mm and a total height of 0.6 mm C2 A3 B3 C3 R1, 100 R2, 47 R3, 100 Ext. IOs A2 B1 C1 GND, B2 BGF106 _schematic.vsd Figure 1 Type BGF106C Schematic Package WLP-8-11 Marking 6C Chip N0727 Data Sheet 4 V2.0, 2009-04-14 BGF106C SIM Card Interface Filter and ESD Protection BGF106C Table 1 Parameter Maximum Ratings Symbol Min. Values Typ. - - - - - - Max. 5.5 +85 +150 60 2 15 V C C mW kV kV 0 -40 -65 - -2 -15 Unit Note / Test Condition - - - Voltage at all pins to GND Operating temperature range Storage temperature range Summed up input power for all pins VP TOP TSTG Pin TS < 70 C - - Electrostatic discharge according to IEC61000-4-2 Contact discharge at internal pins A3, B3, C3 to VESD any other pin Contact discharge at external pins A2, B1, C1, VESD C2 to GND Table 2 Parameter Resistors R1, R3 Resistor R2 Reverse current of ESD protection diodes Breakdown voltage of ESD diodes Line capacitance Capacitance of all lines to GND 1) at TA = 25 C Electrical Characteristics1) Symbol Min. Values Typ. 100 47 1 2 7.8 16.5 Max. 120 56.4 100 1000 - 20 nA nA V pF 80 37.6 - - 6.5 - Unit Note / Test Condition - - R1,3 R2 IR V(BR) CT V=3V V=5V I(BR) = 1 mA V=0V Data Sheet 5 V2.0, 2009-04-14 BGF106C SIM Card Interface Filter and ESD Protection BGF106C Typical Insertion Loss 0 -5 -10 Line B3-B1 Line C3-C1 Line A3-A2 S21 [dB] -15 -20 -25 -30 -35 -40 1 10 100 1000 10000 f [MHz] Figure 2 Insertion loss, ZS=ZL=50 Typical Cross Talk 0 -20 S21 [dB] -40 -60 -80 -100 -120 1 10 100 1000 10000 f [MHz] Figure 3 Cross talk, ZS=ZL=50 (all unused input and output pins are terminated with 50 ) Data Sheet 6 V2.0, 2009-04-14 BGF106C SIM Card Interface Filter and ESD Protection BGF106C Package Outlines Solder balls face down 0.6 0.05 Solder balls face up 1.2 0.05 0.4 0.1 C B Pin A1 2) Corner Index Area (0.2 0.05) 2 x 0.4 = 0.8 A3 B3 A2 B2 C2 B1 C1 (0.2 0.05) (0.2 0.05) (0.2 0.05) 0.2 0.05 STANDOFF A SEATING PLANE 3) C3 C 2 x 0.4 = 0.8 8x o0.05 M A B 0.25 0.04 1) 0.08 C 8x COPLANARITY 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-8-11-N-PO V01 Figure 4 Footprint WLP-8-11 (Wafer Level Package) 0.8 0.4 0.25 WLP-8-11-N-FP V01 Figure 5 Tape Recommended PCB pad design for reflow soldering 4 0.1 1.33 0.05 0.4 0.8 0.25 8 0.1 Pin A1 Corner Index Area 1.33 0.05 0.75 WLP-8-11-N-TP V01 Figure 6 Tape for BGF106C / WLP-8-11 You can find all of our packages, sorts of packing and others in our Infineon Internet Page "Products": http://www.infineon.com/products. Data Sheet 7 V2.0, 2009-04-14 1.2 0.05 0.4 |
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